assembly/connecting technology

• • 

  • wiring boards

  wiring/connecting boards in thin- and thickfilm technology or pcb (dimensions are special adopted to the application, detectors and emitters inclusive electronics)
• precisely positioning of  detector and emitter chips (selection of chips, dimension/active area, spectral response according demands of application)
• radiation resistant assembly of optical components (filters, gratings. lenses …)
• optical passivation of semiconductor chips
  (partial passivation too)
• wiring/connecting technology (assembly of chips,
  • 

  • filter assembly

  bonding, surface
  mount technology, hermetically sealing/welding of TO-packages with
  inert gas filling)

Please contact us directly or the distributor responsible for your region with your special tasks.